Two-stage read/write 3d architecture for memory devices

ABSTRACT

Some embodiments of the present disclosure relate to a memory device wherein a single memory cell array is partitioned between two or more tiers which are vertically integrated on a single substrate. The memory device also includes support circuitry including a control circuit configured to read and write data to the memory cells on each tier, and a shared input/output (I/O) architecture which is connected the memory cells within each tier and configured to receive input data word prior to a write operation, and further configured to provide output data word after a read operation. Other devices and methods are also disclosed.

BACKGROUND

Increasing memory capacity requirements within microelectronic devicesmanufactured in next-generation semiconductor technology nodes combinedwith lower power consumption and higher speed demands has driven anincrease in the number of memory cells per bitline within memory arrays.Increasing the number of memory cells per bitline within memory arrayscan be accomplished through scaling between technology nodes. However,the scaling factor for memory cells within an array can exceed that ofsupport circuitry which surrounds the array.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates some embodiments of a memory device comprising afirst memory cell array on a first tier and a second memory cell arrayon a second tier.

FIG. 2 illustrates an exemplary embodiment of a read/write timingdiagram for the memory device of FIG. 1.

FIG. 3 illustrates some embodiments of a memory device comprising firstand second memory cell arrays residing on first and second tiers,respectively, a control circuit configured to perform read/writeoperations to the first and second memory cell arrays, and a sharedinput/output (I/O) architecture configured to receive an input data wordand further configured to output an output data word.

FIGS. 4A-4C illustrate some embodiments of the shared I/O architectureof FIG. 3.

FIG. 5 illustrates some embodiments of a memory cell comprising a staticrandom access memory (SRAM) cell.

FIG. 6 illustrates some embodiments of a timing diagram for a two-tierread/write operation for a memory array comprising SRAM cells.

FIG. 7 illustrates some embodiments of a method to read and writememory.

FIGS. 8A-8B illustrate cross-sectional views of some embodiments of amemory device comprising a three-dimensional (3D) integrated chip (IC).

DETAILED DESCRIPTION

The description herein is made with reference to the drawings, whereinlike reference numerals are generally utilized to refer to like elementsthroughout, and wherein the various structures are not necessarily drawnto scale. In the following description, for purposes of explanation,numerous specific details are set forth in order to facilitateunderstanding. It may be evident, however, to one of ordinary skill inthe art, that one or more aspects described herein may be practiced witha lesser degree of these specific details. In other instances, knownstructures and devices are shown in block diagram form to facilitateunderstanding.

Semiconductor memory cells include volatile memory types such as staticrandom-access memory (SRAM) or dynamic random-access memory (DRAM), ornon-volatile memory types such as read-only memory (ROM), andnon-volatile read-write memory (NVRWM) such as flash memory. Asemiconductor memory device typically includes an array of such memorycells. Each memory cell in the array is capable of storing one or morebits of data. Therefore, an array arranged in M rows and N columns isable to store N bits of data within M words. One way to increase thecapacity of the memory device (i.e., the number of bits it can store) isto shrink the memory cells making up the memory device, in accordancewith Moore's Law scaling between semiconductor technology nodes, so thatmore memory cells can be fit into a smaller area.

Semiconductor scaling targets memory aggressively. As a result, thescaling factor for memory cells within the array is typically greaterthan the scaling factor for support circuitry which surrounds the arraysuch as logic and analog components. Moreover, as scaling approaches thelower-bound of feature resolution achievable by optical lithographytechniques, new means of scaling such as integrated chip (IC) stackinginto three-dimensional (3D) chip architectures are utilized to decreasechip area. These 3D chip architectures include wafer-on-wafer,die-on-wafer, or die-on-die, which utilize bonded wafers that areelectrically connected by through-silicon vias (TSVs) that are on theorder of 10's of microns wide. More recently, monolithic 3D-ICintegration has allowed for multiple device layers, or “tiers,” to bestacked atop one-another within thin layers of silicon (Si), andelectrically connected through inter-tier vias that are typically lessthan about 100 nm wide. The smaller size of an inter-tier via relativeto a TSV eliminates some parasitic effects associated with thecomparatively large TSV. This monolithic 3D-IC integration has thereforeallowed for stacking of devices within a single chip, which can beapplied not only to memory cells within a memory device, but also to thesupport circuitry as well.

Accordingly, some embodiments of the present disclosure relate to amemory device wherein a single memory cell array is partitioned betweentwo or more tiers which are vertically integrated. The memory devicealso includes support circuitry including a control circuit configuredto read and write data to the memory cells on each tier, and a sharedinput/output (I/O) architecture which is connected the memory cellswithin each tier and configured to receive input data word prior to awrite operation, and further configured to provide output data wordafter a read operation. Other devices and methods are also disclosed.

FIG. 1 illustrates some embodiments of a memory device 100 comprising afirst memory cell array 102A on a first tier 104A and a second memorycell array 102B on a second tier 104B. In some embodiments, the memorydevice 100 comprises a two-port register file (2prf) StaticRandom-Access Memory (SRAM), where the first memory cell array 102A isaccessed through a first port, and the second memory cell array 102B isaccessed through a second port. The 2prf SRAM has some advantages over aone-port register file (1prf) SRAM, including the ability to perform aread and write operations simultaneously within a single clock cycle,due to the multiple ports. The 1prf SRAM, by comparison, can only bewritten to, or read from, within a single clock cycle.

For the embodiments of FIG. 1, the second tier 104B is arranged over thefirst tier 104A. Other embodiments comprise three or more tiers arrangedover one-another in an analogous fashion, so the combined footprint ofthe memory device 100 is the same as that of the single memory cellsarray within a respective tier. The first and second memory cell arrays102A, 102B each comprise an N/2×M array of memory cells 106 (e.g., SRAM,EDRAM, etc.), indicated as C_(ROW-COLUMN). The memory device 100 furthercomprises a control circuit 108 configured to perform a first read/writeoperation by writing a first data value (i.e., Write (Iv0)) to a firstgroup of memory cells 110 (i.e., C₀₋₀, C₀₋₂, . . . C_(0-(n-1))) on thefirst tier 104A while concurrently reading a second data value (i.e.,Read (Iv1)) from a second group of memory cells 112 (i.e., C₀₋₁, C₀₋₃, .. . C_(0-n)) on the second tier 104B. The control circuit 108 is furtherconfigured to perform a second read/write operation by writing a thirddata value (i.e., Write (Iv1)) to a third group of memory cells 114(i.e., C₁₋₁, C₁₋₃, . . . C_(1-n)) on the second tier 104B whileconcurrently reading a fourth data value (i.e., Read (Iv0)) from afourth group of memory cells 116 (i.e., C₁₋₀, C₁₋₂, . . . C_(1-(n-1)))on the first tier 104A.

By partitioning the memory cells of the memory device 100 between thefirst and second tiers 104A, 104B, a greater storage density can berealized compared to conventional memory devices. Also, splittingindividual word read operations and individual word write operationsacross the first and second tiers further helps improve storage densityrelative to conventional solutions.

FIG. 2 illustrates an exemplary embodiment of a read/write timingdiagram 200 for the memory device 100, and is described below withreference to the features of FIG. 1. In some embodiments, the read/writetiming diagram 200 applies to a memory device 100 comprising a 2prfSRAM. The read/write timing diagram 200 illustrates a read/writeoperation 202 where a first N-bit input data word is written to thememory device 100, while a second N-bit output data word is concurrentlyread from the memory device 100.

The write portion of this read/write operation 201 is now described.Prior to the start of the read/write operation 202, an N-bit input dataword and a write address where the N-bit input data word to be writtenare provided to the memory device 100. During a first time interval 204,a memory controller (108, FIG. 1) then writes a first data value, Write(Iv0) 208 (which corresponds to a first N/2 bits of the N-bit input dataword) to the first memory cell array 102A (i.e., through a first port).During a second time interval 206, the memory controller writes a thirddata value, Write (Iv1) 212 (which corresponds to a second N/2 bits ofthe N-bit input data word) to the second memory cell array 102B (i.e.,through a second port). In some embodiments, the second time interval206 directly follows the first time interval 204. For the embodiments ofthe timing diagram 200, there is a time delta (Δt) between the first andsecond time intervals 204, 206. Hence, at the end of the read/writeoperation 202, the full N-bit input data word has been written to thememory device 100, albeit with the N-bits of the input data word beingsplit between the first and second tiers 104A, 104B.

Likewise, prior to the start of the read/write operation 202, a readaddress is provided from which an N-bit output data word is to be read.During the first time interval 204, a second data value, Read (Iv1) 210(which corresponds to a first N/2-bits of the N-bit output data word) isaccessed from the second memory cell array 102B (i.e., through thesecond port). During the second time interval 206, a fourth data value,Read (Iv0) 214 (which corresponds to the second N/2 bits of the N-bitoutput data word) is accessed from the first memory cell array 102A(i.e., through the first port). At the end of the read/write operation202, the N-bit output data word is then provided to output pins of thememory device 100, wherein the N-bits of the output data word have been“gathered” from over the first and second tiers 104A, 104B.

FIG. 3 illustrates some embodiments of a memory device 300 comprisingfirst and second memory cell arrays 102A, 102B residing on first andsecond tiers 104A, 104B. The first and second memory cell arrays 102A,102B are coupled to first and second row decoders 302A, 302B,respectively. The memory device 300 further comprises a control circuit108 configured to perform read/write operations to the first and secondmemory cell arrays 102A, 102B. The control circuit 108 comprises anaddress decoder 304 configured to identify an odd or even address,A(m,n_(odd)) or A(m,n_(even)) within the first or second memory cellarrays 102A, 102B, respectively. A(m,n_(odd)) or A(m,n_(even))correspond to a word line WL[0]-WL[m] (Iv0) or WL[0]-WL[m] (Iv1) withinthe first or second memory cell arrays 102A, 102B, respectively. Thecontrol circuit 108 further comprises a read/write clock (clk) 306configured to generate a read/write clk signal (RWB), which is sent to ashared input/output (I/O) architecture 308 to control writing of inputdata to, and reading of output data from, the first and second memorycell arrays 102A, 102B.

The shared I/O architecture 308 is connected to the first memory cellarray 102A through first complimentary bitlines BL[0], BL[2], . . .BL[n-1], BLB[0], BLB[2], . . . BLB[n-1], and connected to the secondmemory cell array 102B through second complimentary bitlines BL[1],BL[3], . . . BL[n], BLB[1], BLB[3], . . . BLB[n]. The shared I/Oarchitecture 308 is configured to receive first and second data values,Write (Iv0) and Read (Iv1), as inputs and outputs, respectively, of thefirst read/write operation, and further configured to receive the thirdand fourth data values, Write (Iv1) and Read (Iv0), as inputs andoutputs, respectively, of the second read/write operation. Details ofthe operation of the shared I/O architecture 308 will be demonstrated insubsequent embodiments.

FIG. 4A illustrates some further embodiments of the shared I/Oarchitecture 308. The shared I/O architecture 308 is again connected tofirst and second memory sub-arrays 402, 404. The first memory sub-array402 resides on a first tier 104A and the second memory sub-array 404resides on a second tier 104B. In the physical design (i.e., themanufactured circuit), the second tier 104B is arranged in an 3D-ICpackage which encloses both the first and second tiers 104A, 104B so thesecond tier 104B is arranged over the first tier 104A, and subsequentlythe second memory sub-array 404 is arranged directly over the firstmemory sub-array 402. For an N×M memory array, this arrangement reducesthe overall footprint of the array by about 50%, as half of the cellsare placed on the second tier over the first tier.

In some embodiments of an N ×M memory array, odd columns, or firstcomplimentary bitlines, BL[0], BL[2], . . . BL[n-1], BLB[0], BLB[2], . .. BLB[n-1], are partitioned into a first sub-array 402 residing on thefirst tier 104A, and the remaining even columns, or second complimentarybitlines, BL[1], BL[3], . . . BL[n], BLB[1], BLB[3], . . . BLB[n] arepartitioned into a second sub-array 404 residing on the second tier104B. As a result, an even column of the second sub-array 404 residesdirectly over an odd column of the first sub-array 402. Within theshared I/O architecture 308 input data is written to a respective columnof the first or second sub-array 402, 404 by a shared write element 406.Likewise, output data is read from a respective column of the first orsecond sub-array 402, 404 by a shared read element 408. To furtherreduce area in the physical design, the shared read element 408 isarranged on the second tier 104B over the shared write element 406 onthe first tier 104A, or vice versa, to further reduce the overallfootprint.

Collectively, the shared write elements 406 are configured to receivefirst and third data values, Write (Iv0) and Write (Iv1), and to writethe first data value Write (Iv0) to a first group of memory cells (i.e.,row) within the first sub-array 402, and to successively write the thirddata value Write (Iv1) to a third group of memory cells (i.e., row)within the second sub-array 404. Similarly, the shared read elements 408are collectively configured to read a second data value Read (Iv1) froma second group (i.e., row) of memory cells within the second sub-array404, and to successively read a fourth data value Read (Iv0) from afourth group (i.e., row) of memory cells within the first sub-array 404.

FIG. 4B illustrates some embodiments of a shared write element 406. Theshared write element 406 comprises first and second multiplexers (muxs)410A, 410B configured to select between first or second complimentaryinput data signals DIN[0], DINB[0] or DIN[1], DINB[1], respectively, inresponse to the read/write clk signal (RWB). The shared write element406 passes the first or second complimentary input data signals DIN[0],DINB[0] or DIN[1], DINB[1] to first or second complimentary bitlinesBL[0], BLB[0] or BL[1], BLB[1], respectively, when a WPASS_LVO signal orWPASS _LV1 signal is asserted, respectively, as will be demonstrated inFIG. 6.

FIG. 4C illustrates some embodiments of a shared read element 408. Theshared read element 408 is configured to receive a first or secondcomplimentary output data signal, DOUT[0], DOUTB[0] or DOUT[1],DOUTB[1], from the first or second complimentary bitlines BL[0], BLB[0]or BL[1], BLB[1], respectively, in response to a RPASS_LV0 signal orRPASS_LV1 signal, respectively, as again will be demonstrated in FIG. 6.The shared read element 408 comprises a differential sense amplifier(SA) 410, comprising cross-coupled inverters, and configured to amplifythe first or second complimentary output data signals, DOUT[0], DOUTB[0]or DOUT[1], DOUTB[1]. When the RPASS_LV0 signal or RPASS_LV1 signal isasserted, the first or second complimentary output data signals,DOUT[0], DOUTB[0] or DOUT[1], DOUTB[1] charge internal nodes of thedifferential SA 410 to slightly different potentials. The cross-coupledinverters of the differential SA 410 each comprise a pull-down element(e.g., an n-type transistor on series with a p-type transistor). Whenpotentials discharge, the delta in voltage in conjunction with thecross-coupled configuration results in the smaller of DOUT[0], DOUTB[0]or DOUT[1], DOUTB[1] being pulled to ground (i.e., logical “0”) with thelarger of DOUT[0], DOUTB[0] or DOUT[1], DOUTB[1] being pulled to itsoriginal potential (i.e., logical “1”). The shared read element 408further comprises first and second de-multiplexers (de-muxs) 414A, 414Bconfigured to select between the first or second complimentary outputdata signals DOUT[0], DOUTB[0] or DOUT[1], DOUTB[1], in response to theread/write clk signal (RWB).

In some embodiments, the memory cell 106 comprises an SRAM cell for a2prf memory device, as is illustrated in FIG. 5. For the embodiments ofFIG. 5, the memory cell 106 comprises a six-transistor (6T) SRAM,further comprising cross-coupled inverters 502 configured to store data(i.e., a single bit) on complimentary storage nodes 504A, 504B. Thememory cell 106 is coupled to complementary bitlines (BL and BLB)through first and second pass gates 506A, 506B, which are controlled bya wordline (WL). In write mode, input data values DIN[0], DINB[0] orDIN[1], DINB[1] are applied to BL and BLB by the shared write element406. The WL is then set to high which allows the input data value andits compliment to pass to the cross-coupled inverters 502, where it isstored as a voltage on the complimentary storage nodes 504A, 504B, as Qand QB, respectively

To read a data value from the memory cell 106, the complimentarybitlines BL, BLB are first decoupled from the cross-coupled inverters502 by opening the cross-coupled inverters 502 (i.e., setting the signalWL=0), thereby decoupling the complimentary bitlines BL, BLB from thecomplimentary storage nodes 504A, 504B. While decoupled, charge isleaked from a supply voltage V_(DD) onto the complimentary bitlines BL,BLB. This pre-charged condition often represents a condition where thecomplimentary bitlines BL, BLB are charged to V_(DD), meaning that bothcomplimentary bitlines BL or BLB are in a logical “1” state. Afterpre-charging to the complimentary bitlines BL, BLB, the first and secondpass gates 506A, 506B are again opened, causing the voltages stored onthe complimentary storage nodes 504A, 504B, Q and QB, to transfer to thecomplimentary bitlines BL, BLB, respectively. The transferred voltagesare then output as the complimentary output data signal, DOUT[0],DOUTB[0] or DOUT[1], DOUTB[1], and sent to the shared read element 408.

FIG. 6 illustrates some embodiments of a timing diagram 600 for thetwo-tier read/write operation for a memory array comprising SRAM cells,and is described below with reference to the features of FIGS. 4A-4C andFIG. 5. It is appreciated that the general formulation of the timingdiagram 600 and associated two-tier read/write operation for a memoryarray may be applied to various memory types such as SRAM, dynamicrandom-access memory (DRAM), or non-volatile read-write memory (NVRWM)such as flash memory, and the like.

At t₀ complimentary bitlines BL[0]/BLB[0] are pre-charged (or reset) toV_(DD) (i.e., logical “1” state). Also at t₀ read/write clk signal (RWB)is 0, corresponding to a low (i.e., “0”) read clk state, and a high(i.e., “1”) write clk state.

At t₁ WPASS_LV0 is asserted in the shared write element 406 so that Iv0complimentary bitlines BL[0]/BLB[0] receive first complimentary inputdata signals DIN[0]/DINB[0]. Also at t₁, WL[0] (Iv0) is simultaneouslyasserted so that the values of DIN[0]/DINB[0] are stored as a voltage onthe complimentary storage nodes 504A, 504B of a Iv0 memory cell 106.

At t₂ WPASS_LV0 returns to 0 and a first half of a first write operationis complete. Also at t₂, complimentary bitlines BL[0]/BLB[0] arepre-charged (or reset) to V_(DD). Also at t₂, RWB is simultaneouslyasserted so that the first and second muxs 410A, 410B select the secondcomplimentary input data signals DIN[1]/DINB[1] as inputs to the sharedwrite element 406.

At t₃ WPASS_LV1 is asserted in the shared write element 406 so that Iv1complimentary bitlines BL[1]/BLB[1] receive the second complimentaryinput data signals DIN[1]/DINB[1]. Also at t₃, WL[0] (Iv2) issimultaneously asserted so that the values of DIN[1]/DINB[1] are storedas a voltage on the complimentary storage nodes 504A, 504B of a Iv1memory cell 106.

At t₄ WPASS_LV1 returns to 0 and a second half of the first writeoperation is complete. Also at t₄, complimentary bitlines BL[1]/BLB[1]are pre-charged (or reset) to V_(DD).

At t₅ a first word cycle is complete. Note that the first (N-bit) writeoperation illustrated for Iv0 and Iv1 memory cells 106 above occurswithin the first word cycle occurs simultaneously with a first readoperation. Likewise, second write and read operations occursimultaneously within a second word cycle which immediately follows thefirst word cycle.

Simultaneously, at t₅ the second word cycle begins (i.e., Δt=0). BL[1]and BLB[1] are charged to V_(DD). WL[0] (Iv1) is asserted, which couplesBL[1], BLB[1] to the Iv1 memory cell 106. And, RPASS_LV1 issimultaneously asserted in the shared read element 408.

At t₆ SAE is asserted, and DOUT[1]/DOUTB[1] are read from BL[1]/BLB[1]through the first and second de-muxs 414A, 414B of the shared readelement 408. As a result, at t₆ the differential SA 410 senses thevoltage difference between BL[1] and BLB[1].

At t₇ RPASS_LV1 returns to zero and a first half of the second readoperation is complete. Also at At t₇,

At t₈ BL[0] and BLB[0] are charged to V_(DD). WL[0] (Iv0) is asserted,which couples BL[0], BLB[0] to the Iv0 memory cell 106. And, RPASS_LV0is simultaneously asserted in the shared read element 408.

At t₉ SAE is asserted, and DOUT[0]/DOUTB[0] are read from BL[0]/BLB[0]through the first and second de-muxs 414A, 414B of the shared readelement 408. As a result, at t₉ the differential SA 410 senses thevoltage difference between BL[0] and BLB[0].

At t₁₀ RPASS_LV0 returns to zero and a second half of the second readoperation is complete.

Note that for the embodiments of a timing diagram 600 signals can beshared between the shared write element 406 and the shared read element408. For instance, WPASS_LV1=RPASS_LV0, and RPASS_LV1=WPASS_LV0.Moreover, as illustrated in FIGS. 4C-4C, RWB controlling the first andsecond muxs 410A, 410B of the shared write element 406 may be invertedto generate RW to control the first and second de-muxs 414A, 414B of theshared read element 408

FIG. 7 illustrates some embodiments of a method 700 to read and writememory. While the method 700 is described below as a series of acts orevents, it will be appreciated that the illustrated ordering of suchacts or events are not to be interpreted in a limiting sense. Forexample, some acts may occur in different orders and/or concurrentlywith other acts or events apart from those illustrated and/or describedherein. In addition, not all illustrated acts may be required toimplement one or more aspects or embodiments of the description herein.Further, one or more of the acts depicted herein may be carried out inone or more separate acts and/or phases.

At 702 a memory array is partitioned into first and second tiers,wherein the second tier resides over the first tier. In someembodiments, the memory array comprises an N-bit memory array furthercomprising M rows and N columns. In some embodiments, partitioning theN-bit memory array into first and second tiers comprises forming a firstsub-array comprising M rows and N/2 columns, where the N/2 columns ofthe first sub-array comprise odd numbered columns of the memory array.These embodiments further comprise forming a second sub-array comprisingM rows and N/2 columns, where the N/2 columns of the second sub-arraycomprise even numbered columns of the N-bit memory array.

At 704 a first read/write operation is performed by writing a first datavalue to a first group of memory cells on the first tier whileconcurrently reading a second data value from a second group of memorycells on the second tier.

At 706 a second read/write operation is performed by writing a thirddata value to a third group of memory cells on the second tier whileconcurrently reading a fourth data value from a fourth group of memorycells on the first tier.

In some embodiments of the method 700, the first data value is made upof N/2-bits and the third data value is made up of N/2-bits such thatthe first and third data values collectively correspond to an N-bitinput data word provided to the memory array prior to the firstread/write operation. In some embodiments of the method 700, the seconddata value is made up of N/2-bits and the fourth data value is made upof N/2-bits such that the second and fourth data values collectivelycorrespond to an N-bit output data word provided by the memory arrayafter the first read/write operation.

FIG. 8A illustrates a cross-sectional view of some embodiments of amemory device 800A comprising a 3D-IC, further comprising a first tier802A vertically disposed below a second tier 804A on a semiconductorsubstrate 806A. In various embodiments, the semiconductor substrate 806Amay comprise any type of semiconductor body (e.g., silicon,silicon-germanium, silicon-on-insulator, etc.) such as a semiconductorwafer and/or one or more die on a semiconductor wafer, as well as anyother type of semiconductor associated therewith.

The first tier 802A comprises a first device structure (i.e.,field-effect transistor) 808A disposed over an oxide layer 810A. In someembodiments, the first device structure 808A is disposed over thesubstrate with no intervening oxide layer 810A. A first local via 812Aconnects the first device structure 808A to a first metallization plane814A. Likewise, the second tier 804A comprises a second device structure816A disposed over an inter-layer dielectric (ILD) 818A. In someembodiments, the ILD 818A comprises nearly pure Si with a thickness ofless than about 1,000 nm. A second local via 812A connects the seconddevice structure 816A to a second metallization plane 814A. Aninter-tier via 824A connects the first and second device structures808A, 816A through the second metallization plane 814A. In someembodiments, the first and second device structures 808A, 816A resideinside Iv0 and Iv1 memory cells (106 of FIG. 1), respectively. In someembodiments, the inter-tier via has a diameter of less than about 100nm. In some embodiments, the first and second tiers 802A, 804A enclosedby a single integrated circuit package.

FIG. 8B illustrates a cross-sectional view of some embodiments of amemory device 800B comprising a 3D-IC, further comprising a first tier802B vertically disposed below a second tier 804B. The first tier 802Bis disposed on a first semiconductor substrate 806B, and the second tier804B is disposed on a second semiconductor substrate 808B, which hasbeen flipped and bonded to the first tier 802B by an epoxy 810B to forma face-to-face 3D-IC.

The first tier 802B comprises a first device structure 812B disposedover a first oxide layer 814B. The second tier 804B comprises a seconddevice structure 816B disposed over a second oxide layer 818B. In someembodiments, the first or second device structure 812B, 816B is disposedover the first or second substrate 806B, 808B with no intervening firstor second oxide layer 814B, 818B. A first local via 820B connects thefirst device structure 812B to a first metallization plane 822B withinthe first tier 802B. Second and third local vias 824B, 828B connect thesecond device structure 816B to second and third metallization planes826B, 830B, respectively. An inter-tier via 832B connects the first andsecond device structures 812B, 816B through the third metallizationplane 830B. In some embodiments, the first and second tiers 802B, 804Benclosed by a single integrated circuit package.

It will also be appreciated that equivalent alterations and/ormodifications may occur to one of ordinary skill in the art based upon areading and/or understanding of the specification and annexed drawings.The disclosure herein includes all such modifications and alterationsand is generally not intended to be limited thereby. In addition, whilea particular feature or aspect may have been disclosed with respect toonly one of several implementations, such feature or aspect may becombined with one or more other features and/or aspects of otherimplementations as may be desired. Furthermore, to the extent that theterms “includes”, “having”, “has”, “with”, and/or variants thereof areused herein; such terms are intended to be inclusive in meaning—like“comprising.” Also, “exemplary” is merely meant to mean an example,rather than the best. It is also to be appreciated that features, layersand/or elements depicted herein are illustrated with particulardimensions and/or orientations relative to one another for purposes ofsimplicity and ease of understanding, and that the actual dimensionsand/or orientations may differ substantially from that illustratedherein.

Therefore, some embodiments of the present disclosure relate to a memorydevice wherein a single memory cell array is partitioned between two ormore tiers which are vertically integrated on a single substrate. Thememory device also includes support circuitry including a controlcircuit configured to read and write data to the memory cells on eachtier, and a shared input/output (I/O) architecture which is connectedthe memory cells within each tier and configured to receive input dataword prior to a write operation, and further configured to provideoutput data word after a read operation. Other devices and methods arealso disclosed.

In some embodiments, the present disclosure relates to a memory devicecomprising a first memory cell array on a first tier, and a secondmemory cell array on a second tier, the second tier being arranged in anintegrated circuit package which encloses both the first and secondtiers so the second tier is arranged over the first tier, or vice versa.The memory device further comprises a control circuit configured toperform a first read/write operation by writing a first data value to afirst group of memory cells on the first tier while concurrently readinga second data value from a second group of memory cells on the secondtier.

In some embodiments, the present disclosure relates to a method to readand write memory, comprising partitioning a memory array into first andsecond tiers, wherein the second tier resides over the first tier, andperforming a first read/write operation by writing a first data value toa first group of memory cells on the first tier while concurrentlyreading a second data value from a second group of memory cells on thesecond tier.

In some embodiments, the present disclosure relates to a memory devicecomprising first and second memory cell arrays arranged in an integratedcircuit package and residing on first and second tiers, respectively,where the second tier is arranged over the first tier, or vice versa.The memory device further comprises a control circuit configured toperform a write operation by partitioning an N-bit input data word intofirst and third data values each comprising N/2-bits, writing the firstdata value to a first group of memory cells on the first tier in a firstinterval, and writing the third data value to a third group of memorycells on the second tier in a second interval. The control circuit isfurther configured to perform a read operation by reading a second datavalue from a second group of memory cells on the second tier in thefirst interval, reading a fourth data value from a fourth group ofmemory cells on the first tier in the second interval, wherein thesecond and fourth data values each comprise N/2-bits, and assembling thesecond and fourth data values into a N-bit output data word. The memorydevice further comprises a shared input/output (I/O) architecture whichis connected the first and second tiers and configured to receive theN-bit input data word prior to the write operation and furtherconfigured to output the N-bit output data word after the readoperation.

What is claimed is:
 1. A memory device comprising: a first memory cellarray on a first tier; and a second memory cell array on a second tier,the second tier being arranged in an integrated circuit package whichencloses both the first and second tiers so the second tier is arrangedover the first tier, or vice versa; and a control circuit configured toperform a first read/write operation by writing a first data value to afirst group of memory cells on the first tier while concurrently readinga second data value from a second group of memory cells on the secondtier.
 2. The memory device of claim 1, wherein the control circuit isfurther configured to perform a second read/write operation by writing athird data value to a third group of memory cells on the second tierwhile concurrently reading a fourth data value from a fourth group ofmemory cells on the first tier.
 3. The memory device of claim 2, whereinthe first data value and third data value are collectively made up ofN-bits and collectively correspond to an N-bit input data word providedonto input pins of the memory device prior to the first read/writeoperation.
 4. The memory device of claim 2, wherein the second datavalue and fourth data value are collectively made up of N-bits andcollectively correspond to an N-bit output data word provided ontooutput pins of the memory device after to the first read/writeoperation.
 5. The memory device of claim 2, further comprising a sharedinput/output (I/O) architecture which is connected the first and secondtiers and configured to receive the first and second data values asinputs and outputs, respectively, of the first read/write operation. 6.The memory device of claim 5, wherein the shared I/O architecture isfurther configured to receive the third and fourth data values as inputsand outputs, respectively, of the second read/write operation.
 7. Thememory device of claim 6, wherein the shared I/O architecture comprisesshared write elements on the first tier, the shared write elementsconfigured to receive the first and third data values from input pins ofthe memory device, to write the first data value to the first group ofmemory cells on the first tier, and to successively write the third datavalue to the third group of memory cells on the second tier.
 8. Thememory device of claim 7, wherein the shared I/O architecture furthercomprises shared read elements on the second tier arranged over theshared write elements on the first tier, the shared read elementsconfigured to read the second data value from the second group of memorycells on the second tier, to successively read the fourth data valuefrom the fourth group of memory cells on the first tier, and to providethe second and fourth data values to output pins of the memory device.9. The memory device of claim 6, wherein a connection between the firstand second tiers comprise inter-tier vias with a diameter of less thanabout 100 nm.
 10. The memory device of claim 1, wherein the first andsecond tiers reside on first and second substrates which are enclosed bythe integrated circuit package.
 11. The memory device of claim 1,wherein the first and second tiers reside on a single substrate, and areenclosed by the integrated circuit package.
 12. The memory device ofclaim 1, wherein the first and second memory cell arrays are made up ofstatic random access memory (SRAM) cells.
 13. A method to read and writememory, comprising: partitioning a memory array into first and secondtiers, wherein the second tier resides over the first tier; andperforming a first read/write operation by writing a first data value toa first group of memory cells on the first tier while concurrentlyreading a second data value from a second group of memory cells on thesecond tier.
 14. The method of claim 13, further comprising performing asecond read/write operation by writing a third data value to a thirdgroup of memory cells on the second tier while concurrently reading afourth data value from a fourth group of memory cells on the first tier.15. The method of claim 14, wherein the memory array comprises an N-bitmemory array further comprising M rows and N columns, and whereinpartitioning the memory array into first and second tiers comprises:forming a first sub-array comprising M rows and N/2 columns; forming asecond sub-array comprising M rows and N/2 columns; wherein the N/2columns of the first sub-array comprise odd numbered columns of thememory array; and wherein the N/2 columns of the second sub-arraycomprise even numbered columns of the memory array.
 16. The method ofclaim 15, wherein the first data value is made up of N/2-bits and thethird data value is made up of N/2-bits such that the first and thirddata values collectively correspond to an N-bit input data word providedto the memory array prior to the first read/write operation.
 17. Themethod of claim 16, wherein the first data value is written to the firstsub-array during a first time interval and the third data value iswritten to the second sub-array during a second time interval, andwherein the second time interval directly follows the first timeinterval.
 18. The method of claim 17, wherein the second data value ismade up of N/2-bits and the fourth data value is made up of N/2-bitssuch that the second and fourth data values collectively correspond toan N-bit output data word provided by the memory array after the firstread/write operation.
 19. The method of claim 18, wherein the seconddata value is read from the second sub-array during the first timeinterval and the fourth data value is read from the first sub-arrayduring the second time interval.
 20. A memory device comprising: firstand second memory cell arrays arranged in an integrated circuit packageand residing on first and second tiers, respectively, wherein the secondtier is arranged over the first tier, or vice versa; a control circuitconfigured to: perform a write operation by partitioning an N-bit inputdata word into first and third data values each comprising N/2-bits,writing the first data value to a first group of memory cells on thefirst tier in a first interval, and writing the third data value to athird group of memory cells on the second tier in a second interval; andperform a read operation by reading a second data value from a secondgroup of memory cells on the second tier in the first interval, readinga fourth data value from a fourth group of memory cells on the firsttier in the second interval, wherein the second and fourth data valueseach comprise N/2-bits, and assembling the second and fourth data valuesinto a N-bit output data word; and a shared input/output (I/O)architecture which is connected the first and second tiers andconfigured to receive the N-bit input data word prior to the writeoperation and further configured to output the N-bit output data wordafter the read operation.